ELSPES Exhibits at DesignCon 2026

ELSPES Inc. was pleased to participate as an exhibitor at DesignCon 2026, held from February 24–26 at the Santa Clara Convention Center, Santa Clara, California — the premier high-speed communications and system design conference and exposition in the heart of Silicon Valley.

DesignCon brought together chip, board, and systems design professionals to explore the latest technologies, tools, and industry trends shaping electronics engineering. ELSPES joined hundreds of exhibitors to showcase our silicon deep trench capacitor solutions, with a focus on their role in high-speed signal and power integrity applications. The event offered an exceptional opportunity to connect with engineers and technology leaders working on next-generation PCB design, high-speed interconnects, and advanced semiconductor architectures — all areas where ELSPES silicon capacitors deliver critical performance advantages.

We engaged in meaningful technical discussions with design engineers and system architects, reinforcing ELSPES's position as a trusted component partner for demanding high-frequency and high-reliability applications. We thank all visitors who stopped by our booth and look forward to seeing you at future events.