ELSPES to Exhibit at ASPS 2025

ELSPES is pleased to announce its participation as an exhibitor at the Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2025, taking place from August 27–29, 2025, at the Suwon Convention Center, Korea.

ASPS is Korea’s premier B2B exhibition dedicated to semiconductor packaging and chiplet technologies, bringing together global leaders in advanced packaging, hybrid bonding, and heterogeneous integration. With over 150 companies and 10,000 visitors expected, the event serves as a major hub for industry collaboration and innovation.

At ASPS 2025, ELSPES will showcase its high-density silicon capacitor solutions, designed to address the growing power delivery challenges in AI, high-performance computing (HPC), and next-generation semiconductor platforms. In addition, ELSPES will highlight its capability in High-Speed I/O AC Coupling Capacitors, which ensure signal integrity by blocking DC offsets while enabling stable high-frequency data transmission—an essential requirement for advanced interfaces such as SerDes, optical transceiver modules (TOSA/ROSA), and antenna systems. ELSPES’s proprietary technology delivers ultra-low leakage, superior stability, and scalable integration capability, making it an ideal enabler for advanced packaging and chiplet architectures.

Through this exhibition, ELSPES looks forward to engaging with global semiconductor manufacturers, OSATs, and system companies to explore opportunities for collaboration and to demonstrate how ELSPES technology can contribute to the future of efficient, reliable, and high-performance power delivery systems.

▼ Booth Layout: A110, located along the right-hand wall from the main entrance