ELSPES Attends 2025 Semiconductor & Photonics Workshop: Focus on Power Efficiency
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ELSPES participated in the 2025 Semiconductor Technologies & Photonics Workshop, held from June 2 to 3 at Penn State University Park, Pennsylvania, USA. Co-hosted by Penn State's Department of Electrical Engineering and National Sun Yat-sen University (NSYSU) of Taiwan, the event brought together global experts and leading semiconductor companies to discuss power efficiency in the era of AI and high-performance computing (HPC).
With the exponential rise of AI workloads and growing constraints on energy resources, power efficiency is no longer optional—it is essential. Despite rapid improvements in software, hardware continues to face bottlenecks in power delivery, communication, and cooling. According to insights shared at the workshop, actual computation accounts for only 33% of total power consumption, underscoring the urgent need for holistic improvements across the power infrastructure.
In response to these challenges, ELSPES has developed silicon capacitor technology targeting the power delivery domain, which alone represents 20% of total power consumption. Minimizing loss in this segment is critical—especially as AI chips approach 1000W power levels—demanding reduced physical distance between the power source and the chip, as well as high-performance decoupling capacitors.
ELSPES's Si capacitors are engineered to meet these demands. They provide stable power delivery and noise suppression even in high-frequency environments, while supporting high-density integration for 3D and vertical packaging structures. As the industry advances toward technologies such as EMIB-t, Co-Packaged Optics (CPO), and integrated passives in advanced packaging, ELSPES is committed to delivering practical solutions aligned with next-generation power architectures.
▶ Recent Related ELSPES News: ELSPES Co-Presents Cutting-Edge Glass-Embedded Silicon Capacitor Technology at ECTC 2025
▶ Recent Related SPN in the Industry Press: ELSPES Advances Silicon Capacitor Density to 2,500 nF/mm² with Ultra-Low Impedance Profile
Looking ahead, ELSPES remains dedicated to driving strategic technological innovation that supports the development of an energy-efficient AI and semiconductor hardware ecosystem.
